Nearly 15-year Experience of Electronics Manufacturing

SATECH biedt one-stop PCB-assemblagediensten voor de productie van elektronica, van de inkoop van componenten, PCB-productie, SMT, DIP, PCB-assemblage tot assemblage van eindproducten. Met de superioriteit van grootschalige inkoop (van IC, weerstanden, capaciteit, inductie, diode en audion,enz.) en kwaliteit eerst gevoel, we sluiten contracten met de uitstekende componentenfabrikanten van thuis en aan boord om een ​​partnerschap op lange termijn op te bouwen, dit zorgt voor originele kwaliteit en een stabiel aanbod, gericht op het doorgeven van het voordeel aan onze klanten. We hebben gewerkt voor de klanten uit de VS, Duitsland, Rusland, Jemen, VAE, Japan, Spanje, Frankrijk, Italië, Israël, Iran, Indië, Mexico, Argentinië, Colombia, enz.

pcb assembly line

Turnkey PCB Board Assembly Solutions

Since starting in 2003, SATECH has emerged as a trustworthy electronic contract manufacturer (ECM) to meet the demand of fast turnkey PCB assembly solutions. No matter whether it is a sample order or bulk order, we are always effective at reviewing and analyzing BOM and technical files, and quick to source components for rapid quotation. For the production and QC steps, some strict rules and regulations and KPI are available for every facility manager and worker. No quality for you, no life for us.

Ability of manufacturing PCB Assembly Service Facility List
4 SMT processing lines Circuit board production (tot 12 lagen, impedance, HDI, enz.) Fuji CP8 Series Surface-mount Machine
3 DIP processing lines SMT/DIP Automated solder-paste printer
0201 components assy ICT (In-Circuit Test) 10-zone Re-flow Soldering
0.25mm BGA FCT (Functional Circuit Test) AOI Detector
Surface-mount 4 million pins/day BIT (Burn-in Test) Wave-soldering
DIP 1 million pins/day Box Building ICT Working Platform

Supported PCB Assembly Capabilities

  • THD (Thru-Hole Device)
  • SMT (Surface-Mount Technology)
  • SMT & THD combined
  • 2-sided SMT and THD assembly
  • 1 to 5,000 boards
  • Passives parts, smallest size 0201
  • Fine pitch to 8 Mils
  • BGA, uBGA, QFN, POP and Zero-Lead chips
  • Connectors and terminals
  • Reels
  • Cut tape
  • Tube and tray
  • Loose parts and bulk
  • Minimum measurement: 0.2″ x 0.2″ (5mm x 5mm)
  • Largest dimension: 15″ x 20″ (381mm x 508mm)
  • Oblong
  • Round
  • Slots and Cut outs
  • Complicated and Uncommon
  • Rigid FR-4 boards
  • Rigid-Flex boards
  • Leaded process
  • Zero-Lead (RoHS)
  • Gerber RS-274X, 274D, Eagle as well as AutoCAD’s DXF, DWG
  • BOM (Bill of Materials) (.xls, .csv, . xlsx)
  • Centroid (Pick-N-Place Or XY file)
  • Visual Inspection
  • X-ray Inspection
  • AOI (Also known as: Automated Optical Inspection)
  • ICT (AKA: In-Circuit Test)
  • Functional testing
  • 1 To 5 days for only printed circuit board assy
  • 10 To16 days for full Turnkey Circuit Card Assy
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